prEN IEC 61191-10-2:2026
Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2026-09-04
till 2026-11-03
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.180 - Printed circuits and boardsForeignTC'S
CLC/SR 91Number of comments
0Comment start date
2026-09-04