prEN IEC 63378-2-2:2026
Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2026-02-21
till 2026-04-22
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.080.01 - Semiconductor devices in generalForeignTC'S
CLC/TC 47XNumber of comments
0Comment start date
2026-02-21