prEN IEC 63378-4:2026
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2026-02-21
till 2026-04-22
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.080.01 - Semiconductor devices in generalForeignTC'S
CLC/TC 47XNumber of comments
0Comment start date
2026-02-21