prEN IEC 61249-2-54:2025
Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2025-09-13
till 2025-11-12
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.180 - Printed circuits and boardsForeignTC'S
CLC/SR 91Number of comments
0Comment start date
2025-09-13