prEN IEC 61249-2-55:2026
Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2026-11-04
till 2027-01-03
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.180 - Printed circuits and boardsForeignTC'S
CLC/SR 91Number of comments
0Comment start date
2026-11-04