prEN IEC 61189-3-720:2025
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2025-12-27
till 2026-02-25
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.180 - Printed circuits and boardsForeignTC'S
CLC/SR 91Number of comments
0Comment start date
2025-12-27