prEN IEC 63609-2:2026
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2026-09-23
till 2026-11-22
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.180 - Printed circuits and boardsForeignTC'S
CLC/SR 91Number of comments
0Comment start date
2026-09-23