prEN IEC 63378-6:2025
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
Draft Public enquiryProject stage codes
1. Decision on WI Proposal
2. Viešoji apklausa
From 2025-05-31
till 2025-07-30
Organisation
CENELEC Europos elektrotechnikos standartizacijos komitetasICS
31.080.01 - Semiconductor devices in generalForeignTC'S
CLC/TC 47XNumber of comments
0Comment start date
2025-05-31